Triple Play Communications

Custom Hardware and Software Design and Product Manufacturing
TPC designs and manufactures custom hardware and software products with a focus on high quality optical and electrical designs. We are able to react quickly to customer requests and provide short development cycles, high yields, and low production costs. Prior development successes include modular and pluggable optical interface products, including 19" rack mountable chassis with remote software management, operating at rates from 10 Mb/s to 11.4 Gb/s. The TPC design team has a proven track record of developing, qualifying and manufacturing custom hardware and software products. We design the lowest cost solution, both in material costs and production assembly/test times, and verify that it meets all customer requirements. We have experience successfully starting new product lines in multiple Asian manufacturing facilities (contract manufacturers). An example of the deliverable items for a turnkey development are:

Product specification, hardware schematic, software/firmware code, BOM, assembly and mechanical drawings for the module and/or chassis, engineering evaluation board and production test set board
Fully assembled and tested modules and/or chassis with engineering characterization (over voltage and temperature) test results
Optical module, line card, and/or chassis hardware/software interface control document
Qualification (GR-468 or other) test plan and procedure
Production test specification
Hardware and software design theory of operation

Environmental Qualification Testing
TPC utilizes two Espec ESX-3CA temperature and humidity chambers to perform GR-468 style qualification testing for various designs and products. Both of these chambers have 14 cubic feet of interior workspace and a temperature range of
-70C to 150C. Each can achieve a temperature ramp rate of over 10C per minute and has a humidity range of 10% to 98%. These chambers are used for both environmental qualification testing (e.g. 2000 hours high temperature, high humidity) and production testing of large chassis.

Espec ESX-3CA Environmental Chamber
Espec Chamber

Hardware Integration
Typically performed as part of a custom hardware design, TPC can develop an integrated chassis or system utilizing customer specific optical modules or components. For example, TPC can design a chassis using existing SFP, XFP, or 300 pin optical modules to implement much of the desired functionality. In this case we would also develop the firmware/software required to provide remote control and status capability for the entire chassis including all pluggable and 300 pin modules.

Optical and Electrical Characterization Testing
Our custom hardware and software development projects require a great deal of optical component and board level characterization testing. TPC can define and provide a complete set of engineering characterization tests for any component, board, module and/or chassis to allow the customer to determine if the hardware meets all requirements over voltage, temperature, etc. TPC provides a comprehensive report which graphically describes all test results and clearly shows the conditions under which there are performance problems.